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Method for grooving an end-point window in a polishing or planarizing pad

IP.com Disclosure Number: IPCOM000028039D
Publication Date: 2004-Apr-21
Document File: 2 page(s) / 64K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for grooving an end-point window in a polishing or planarizing pad. Benefits include reduction of the rate of detecting an early end-point or false end-point during wafer polishing or planarization.

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Method for grooving an end-point window in a polishing or planarizing pad

Disclosed is a method for grooving an end-point window in a polishing or planarizing pad. Benefits include reduction of the rate of detecting an early end-point or false end-point during wafer polishing or planarization.

         The disclosed method is comprised of grooving an end-point window in a polish pad with any groove pattern, groove shape, groove depth, or groove pitch.

         This method addresses the problem of detecting an early end-point or false end-point during wafer polishing or planarization. No conventional solution exists for this problem (see Figure 1). The disclosed method reduces the rate of early end-point or false end-point detection by grooving an end-point window in a specified pattern or shape, at a particular depth or pitch (see Figure 2). The window may be grooved separately from the pad and then installed in pad, or pad and window may be grooved simultaneously.

Fig. 1

Fig. 2

Disclosed anonymously


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