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Self-Heating Material Using Printed Circuit Technology for Mobile and Other Applications

IP.com Disclosure Number: IPCOM000028044D
Publication Date: 2004-Apr-21
Document File: 2 page(s) / 120K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that consists of embedded traces, buried resistor heating elements, a temperature controller, and solar panel/battery elements to provide uniform heating for computer enclosures made for extreme environmental applications, as well as vehicle window defrosters.

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Self-Heating Material Using Printed Circuit Technology for Mobile and Other Applications

Disclosed is a method that consists of embedded traces, buried resistor heating elements, a temperature controller, and solar panel/battery elements to provide uniform heating for computer enclosures made for extreme environmental applications, as well as vehicle window defrosters.

Background

There is a need to provide heat in common mobile devices without using an external electrical power source. This is particularly useful in situations where electrical power is not easily accessible, and where temperatures exist which make it necessary to have a heat source to maintain the operation of a device. Current solutions exist (such as car rear window defoggers); however, the heating elements are on the surface of the glass and subject to damage by scraping and wiping. In addition, current solutions are not mobile because they require external power.

General Description

The disclosed method consists of embedded traces, buried resistor heating elements, a temperature controller, and solar panel/battery elements to provide uniform heating (see
Figure 1). Starting with the base material, the traces and buried resistors are added using standard build up PCB technology. A second layer of base material is required, combined with a lamination to embed circuitry into the base material. Depending on the application, material may need to be formed before being fully cured after lamination.

Advantages

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