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Method for stacked-die packaging using layered encapsulation, fill and attach technology

IP.com Disclosure Number: IPCOM000028047D
Publication Date: 2004-Apr-21
Document File: 3 page(s) / 97K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for stacked-die packaging using layered encapsulation, fill and attach technology. Benefits include improved process simplicity and improved design flexibility.

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Method for stacked-die packaging using layered encapsulation, fill and attach technology

Disclosed is a method for stacked-die packaging using layered encapsulation, fill and attach technology. Benefits include improved process simplicity and improved design flexibility.

Background

Stacked packages conventionally have spacers between the dice, which are not placed directly on top of wire bonds without smaller spacers. The die locations are dictated by the spacer capabilities and wire bond areas (see Figure 1).

Bridged die design layouts are not possible due to the occurrence of gaps that cannot be filled during the encapsulation process.

Conventionally, smaller die must be stacked on top of larger die with spacers between each die. These spacers have interconnect capabilities to enable smaller die to be bonded out on both sides. The spacers and pyramid-type stack-up make the package larger and thicker.

General description

The disclosed method is stacked-die packaging using layered substrate-fill technology.

         The key elements of the method include:

•         Layered stacking

•         Die encapsulation

•         B-stage die attach

•         Protected wirebonds

•         Stacked-die package

•         Die bridging

•         Staggered-pitch substrate

Advantages

         The disclosed method provides advantages, including:

•         Improved process simplicity due to eliminating multiple process steps that are associated with spacer technology

•         Improved design flexibility due to reducing the package form factor and total height

Detailed description

The disclosed method is a layered package without spacers. They are replaced with a layered stack design that can be encapsulated in stages during the process and is complete when all the die have been stacked. The stack-up is ~2-4 mils per die depending o...