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One-Time Printing of Multiple Types of Solder Paste on Substrate Panels

IP.com Disclosure Number: IPCOM000028048D
Publication Date: 2004-Apr-21
Document File: 2 page(s) / 262K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that enables multiple paste types to be printed onto a substrate with only one printing instance. Benefits include improving productivity by eliminating process steps.

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One-Time Printing of Multiple Types of Solder Paste on Substrate Panels

Disclosed is a method that enables multiple paste types to be printed onto a substrate with only one printing instance. Benefits include improving productivity by eliminating process steps.

Background

Currently, substrate suppliers use multiple processes and machines to solder print various types of solder paste (see Figure 1). For example, if a supplier prints Regular Leaded Solder Paste on the C4 bump area of the substrate, and prints Lead Free solder paste on the chip cap pads of the same substrate, the supplier uses one machine and stencil for the first step, then uses another machine, stencil, and solder paste for the second step.

General Description

The disclosed method enables multiple paste types to be printed onto a substrate with only one printing instance (see Figure 2). The disclosed method ensures that the solder pads of similar paste types do not overlap in the direction of the paste printing. It also compartmentalizes the stencils with separate “drains” for the various solder paste types, and has specially designed squeegees that fit within the new stencil “drains” (see Figure 3). The walls of the “drain” and squeegee design prevent the solder paste of one drain from spilling over into the next.

Advantages

The disclosed method improves productivity by eliminating process steps (i.e. uses a single machine to carry out multiple steps).

Fig. 1

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Fig. 3

Disclosed anonymously