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Design for an Expanded Structural Foam Stiffener

IP.com Disclosure Number: IPCOM000028052D
Publication Date: 2004-Apr-21
Document File: 2 page(s) / 43K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a stiffener created by bonding a fiberglass or metal foil skin to a printed circuit board (PCB), using expanded structural foam. Benefits include a solution that enables the use of thinner, less expensive PCBs.

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Design for an Expanded Structural Foam Stiffener

Disclosed is a method for a stiffener created by bonding a fiberglass or metal foil skin to a printed circuit board (PCB), using expanded structural foam. Benefits include a solution that enables the use of thinner, less expensive PCBs.

Background

Increasing the stiffness of PCBs allows them to accept larger mechanical loads. PCBs with insufficient stiffness are susceptible to solder joint reliability issues, and cannot use larger heat sinks to improve thermal management. Currently, .062 thick circuit boards are the standard. If a stiffer board is required, then a thicker board is used or mechanically attached stiffeners are used on the standard board.

General Description

The disclosed method uses a stiffener created by bonding a fiberglass or metal foil skin to a PCB, using expanded structural foam. The following are the key elements of the disclosed method:

§         Structural foam (used as the bonding agent)

§         A PCB (used as one skin)

§         A fiberglass or metal foil skin (used as the second skin)

Figure 1 shows the process flow summary of the disclosed method; Figure 2 shows the process details of the disclosed method.

Advantages

The following are advantages of the disclosed method:

§         Decreases solder joint reliability issues

§         Improves thermal management

§         Enables the use of thinner, less expensive PCBs

Fig. 1

Fig. 2

Disclosed anonymously