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Mechanical stress release construction for ceramic surface mounted components

IP.com Disclosure Number: IPCOM000028088D
Publication Date: 2004-Apr-23
Document File: 2 page(s) / 80K

Publishing Venue

The IP.com Prior Art Database

Abstract

ID615169

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ID615169

Mechanical stress release construction

for ceramic surface mounted components

In many electronic circuits,

the components (such

     as ceramic surface mounted components) have a thermal expansion

coefficient that differs from the expansion coefficient of the

substrate that these components

are mounted on.

This problem

can

be solved

to

a large extent by making

   the substrate more resilient

in places where

the components

are connected

it,

for instance

by making slits

to

in

the substrate

at

two opposing sides

of

a connection between

the component and

the substrate.

In case

the component

is close

to

the edge

of substrate,

one slit will be sufficient.

The figure shows an example in which four ceramic components

     are mounted on a substrate, two on

each side

of the

substrate. Components

on different sides substrate

are mounted right above each other.

The

two slits strongly reduce

the

 mechanical stress, when the temperature

is changing.

Disclosed anonymously.

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