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Method for front-side sealed edge/bevel cleaning apparatus

IP.com Disclosure Number: IPCOM000029141D
Publication Date: 2004-Jun-16
Document File: 4 page(s) / 53K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for front-side sealed edge/bevel cleaning apparatus. Benefits include improved functionality and improved reliability.

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Method for front-side sealed edge/bevel cleaning apparatus

Disclosed is a method for front-side sealed edge/bevel cleaning apparatus. Benefits include improved functionality and improved reliability.

Background

              The outer edge of a silicon wafer can be straight or beveled. Conventional fabrication hardware designs for cleaning a wafer’s edge/bevel can lead to a non-robust process. The entire wafer is exposed to the etch chemistry, resulting in stains on the wafer surface, poor edge quality, and bad concentricity. Additionally, the designs require a lot of maintenance and are prone to failure.

              These problems are conventionally solved by frequent intrusive preventative maintenance (PM) procedures and constant monitoring of the edge/bevel clean module to ensure the hardware (HW) is not failing or drifting out of alignment (see Figure 1).

General description

      The disclosed method seals the front side of the wafer during the edge/bevel clean process, preventing the liquid from reaching the parts of the wafer surface that should not be etched.

              The key elements of the method include:

•             Chuck to hold and rotate the wafer

•             Soft, acid resistant material that forms a seal on the wafer frontside

•             Solid lid to cover the wafer frontside

•             One or more nozzles to dispense etch chemistry

Advantages

              The disclosed method provides advantages, including:

•             Improved functionality due to improving film removal from the wafer edge without exposing the wafer to harsh chemicals

•             Improved reliability due to preventing stains on the wafer surface, poor edge quality, and bad concentricity

Detailed description

              The disclosed method is implemented within a fabrication chamber. The method...