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Method for setting coater/developer critical gap spacing in photo-resist tracks

IP.com Disclosure Number: IPCOM000029144D
Publication Date: 2004-Jun-16
Document File: 3 page(s) / 151K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for setting coater/developer critical gap spacing in photo-resist tracks. Benefits include improved functionality, improved performance, and improved throughput.

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Method for setting coater/developer critical gap spacing in photo-resist tracks

Disclosed is a method for setting coater/developer critical gap spacing in photo-resist tracks. Benefits include improved functionality, improved performance, and improved throughput.

Background

      In semiconductor processing, inaccurate spacing between the coater nozzle and wafer during photo-resist dispense can cause poor cross-wafer resist uniformity, leading to a degradation in cross-wafer critical dimension (CD) control. Inaccurate spacing between the developer dispense nozzle and wafer (as well as developer rinse spacing) can result in pattern defects and cross-wafer CD irregularity.

      The setting of critical gaps in photo-resist tracks has conventionally been performed using multiple feeler gauges (one for each gap spacing). These tools are manufactured using a process that leaves machine oil on the tool, which is incompatible with use inside the photo-resist track without first undergoing appropriate decontamination procedures.

Description

      The disclosed method is a single hand-held measurement tool for setting critical gap spacing for photo-resist track coater and developer nozzle heights. The tool establishes the correct spacing for the following processes:
•             Resist dispense

•             Developer dispense

•             Edge bead removal (EBR)

•             Water rinse

•             Defining the gap between the wafer and the coater cup edge

     ...