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Process Test at Silicon Level, or Package and Silicon, in the Same Tester Module Footprint

IP.com Disclosure Number: IPCOM000029145D
Publication Date: 2004-Jun-16
Document File: 3 page(s) / 305K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for manipulating a test head to a wafer test application, or a package and silicon application, all contained within a single tester footprint. Benefits include reducing product development time.

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Process Test at Silicon Level, or Package and Silicon, in the Same Tester Module Footprint

Disclosed is a method for manipulating a test head to a wafer test application, or a package and silicon application, all contained within a single tester footprint. Benefits include reducing product development time.

Background

Currently, separate socketings and test sequences are used to conduct test capabilities at the silicon contact test and the package silicon contact test (see Figure 1).

General Description

In the disclosed method, a manipulator unit suspends the test head above the floor, enabling the test head to be docked in either the prober or package handler positions (see Figures 2 and 3). The process requires two people to operate, and is best described as moving from package handler to prober in the following process steps:

1.      Beginning with the package handler as a point of reference. Unlock the clamper to release the docking mechanism.

2.      Using vertical motion of the manipulator, Z down the test head in the vertical column to .5 inches away from the floor.

3.      Using the base in and out motion of the manipulator, back the test head completely away from the package handler. The manipulator stops at the full range of motion.

4.      Remove the class test interface HW, and install the wafer test motherboard interface.

5.      Reference the test head IGUS chain strain relief cross bar.

6.      Vertical up the test head to allow for a one-to-two foot floor clearance.

7.      Begin the tumble motion clockwise.

8.      Stop before the IGUS cross bar clears the back side of the handler.

9.      Z up the test head and clear the han...