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Printed Circuit Board Via with Padded Semi-Sphere Pin for BGA Solder Improvements

IP.com Disclosure Number: IPCOM000029151D
Publication Date: 2004-Jun-16
Document File: 2 page(s) / 180K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method which pads semi-sphere pin into an enlarged Printed Circuit Board (PCB) via hole; to enhance soldering, the pins are used as pads for the Ball Grid Array (BGA).

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Printed Circuit Board Via with Padded Semi-Sphere Pin for BGA Solder Improvements

Disclosed is a method which pads semi-sphere pin into an enlarged Printed Circuit Board (PCB) via hole; to enhance soldering, the pins are used as pads for the Ball Grid Array (BGA).

Background

Currently, solder joint defects (i.e. opens and cracks) are a common problem at the BGA device. To remedy this problem, improvements have been made to the front-end of the manufacturing process, and test fixture design rules have been included at the back-end of the process; these measures help reduce the risk of BGA opens and cracks.

The BGA package is mounted onto the solder pad on the PCB, which provides continuity between the BGA ball and the PCB (see Figure 1). Mounting the BGA package in this way forms a solder joint between the BGA ball and the PCB (see Figure 2).

General Description

In the disclosed method, the solder pad is no longer needed; it is replaced by semi-sphere pins.  The semi-sphere pins are padded into the enlarged PCB via holes during the PCB fabrication process (see Figure 3). Figure 4 shows the BGA package mounted onto the semi-sphere pins on the PCB, where the BGA ball forms a solder joint with semi-sphere pins.

Advantages

The following are advantages of the disclosed method:

§         Simplifies PCB routing and maximizes usage of the PCB area.

§         Increases the area of contact between the BGA ball and the PCB, thereby improving solder joint strength and reliability

Fig. 1

Fig. 2

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