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Method for high-density semiconductor packages from substrates fabricated on continuous reels

IP.com Disclosure Number: IPCOM000029161D
Publication Date: 2004-Jun-16
Document File: 9 page(s) / 1M

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for high-density semiconductor packages from substrates fabricated on continuous reels. Benefits include improved functionality, improved performance, improved reliability, and improved yield.

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Method for high-density semiconductor packages from substrates fabricated on continuous reels

Disclosed is a method for high-density semiconductor packages from substrates fabricated on continuous reels. Benefits include improved functionality, improved performance, improved reliability, and improved yield.

Background

              Reducing the cost of manufacturing single or multi-layer organic packages and substrates used for semiconductor devices is an on-going activity. Goals include producing lower cost, higher circuit density multilayer substrates with increased flexibility in changing or removing individual circuit pattern layers. Additionally, the total manufacturing floor space and throughput time must be reduced.

              Conventionally, multi-layer package substrates are manufactured in array panels using batch-processing techniques. Organic packages and substrates are produced in panel formats employing a starting core of material. Multiple individual pattern layers for individual packages are added in an array format using additive build-up and/or subtractive processing steps while in a large panel format. Individual units are singulated into individual packages and/or substrates after final processing in panel form. Large photomask plates, large photolithographic exposure systems and large alignment tables are required because of the panel size. Circuit density increases and trace-space pitch reduction is evolutionary with a long learning cycle between improvements. Starting materials and subsequent processes tend to limit circuit density increases and the reduction of trace-space pitches.

              The inherent advantages of continuous manufacturing processes is well known but have not been applied to the production of semiconductor packages and/or substrates. They are currently produced using techniques that have evolved from the manufacture of back-planes and large printed circuit boards.

              A proof-of-concept can be visualized from the cinematography industry where movie film is produced in a continuous reel-to-reel format, such as the following:

•             Transport (sprocket holes)

•             Application of multiple emulsions (applying photoresist)

•             Alignment and exposure of the composite emulsion within individual frames (aligning the dielectric-copper composite)

•             Developing the emulsions in multiple chemical tanks (electroplating baths)

•             Singulating the continuous film into individual slides comprised of one frame representing the entire composite

General description

              The disclosed method is high circuit density single or multi-layer packages and/or substrates using continuous process reel-to-reel manufacturing techniques. The method requires the use of less overall manufacturing floor space and results in an improvement in throughput time. The in-line testing of individual packages and/or substrates can occur prior to singulation.

              The method uses conti...