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Method for a bridge interconnect for very long wires

IP.com Disclosure Number: IPCOM000029164D
Publication Date: 2004-Jun-16
Document File: 2 page(s) / 59K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a bridge interconnect for very long wires. Benefits include improved functionality and improved performance.

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Method for a bridge interconnect for very long wires

Disclosed is a method for a bridge interconnect for very long wires. Benefits include improved functionality and improved performance.

Background

      Very long wire bonds are common to wire-bonded electronic packages. Conventionally, the problem has been mitigated by limiting the length of wire bonds, typically to 2.0-mm maximum length. Wire-bondability of wires with 2.8-mm length is being validated.

      Conventionally, the die is wire-bonded by stitch bonds from the die bond pads directly to the substrate lead fingers that connect the die to the BGA interconnects underneath the substrate. The substrate lead fingers are typically located near the die edge to provide the first level interconnect. The corner of the die usually have the longest wire bond compared to other die pins. The longest wires occur when dice are stacked (see Figure 1).

General description

      The disclosed method is groups of substrate lead fingers that are bridge interconnects between die pads and lead fingers. The method is applicable when bond wires are too long, which could lead to wire shorts due to wire sway/sweep. The method utilizes intermediate substrate lead fingers that act as a bridge interconnect or bond finger.

Advantages

              The disclosed method provides advantages, including:

•             Improved functionality due to providing groups of substrate lead fingers that are bridge interconnects between die pads an...