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Liquid Blue Wire of Multilayer Printed Circuit Boards Using Colloidal Silver Paste

IP.com Disclosure Number: IPCOM000029165D
Publication Date: 2004-Jun-16
Document File: 2 page(s) / 43K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a colloidal silver paste as an electrical conducting medium for modifying printed circuit board (PCB) circuits. Benefits include a solution that is flexible and uses inexpensive tools.

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Liquid Blue Wire of Multilayer Printed Circuit Boards Using Colloidal Silver Paste

Disclosed is a method that uses a colloidal silver paste as an electrical conducting medium for modifying printed circuit board (PCB) circuits. Benefits include a solution that is flexible and uses inexpensive tools.

Background

Current methods require expensive soldering or wire bonding equipment that heat the solder connections, often destroying fragile PCB traces and other materials. In addition, it is difficult to access the lower PCB metal lines because of current mechanical milling procedures.

General Description

The disclosed method uses a colloidal silver paste as an electrical conducting medium for modifying PCB circuits (see Figure 1). The steps for the disclosed method are as follows:

1.      Expose the copper conductors multiple layers. The disclosed method uses localized laser ablation to etch into various layers of the PCB. The laser etch process has a high selectivity ratio that exposes, but does not disturb, the underlying copper traces.

2.      Cut or isolate the copper conductors multiple layers. Localized lasers cut the copper conductors at various layers within the PCB. The laser beam is scanned (using galvanometers) perpendicular to the line length. The system is run in deposition mode with a  process gas set at zero Torr.

3.      Add colloidal silver paste to the connect traces and add components. The colloidal silver paste is applied in liquid form with a small “modeling” brush or...