Browse Prior Art Database

Automatic Wafer Backside Inspection

IP.com Disclosure Number: IPCOM000029473D
Original Publication Date: 2004-Jul-25
Included in the Prior Art Database: 2004-Jul-25
Document File: 1 page(s) / 18K

Publishing Venue

Siemens

Related People

Juergen Carstens: CONTACT

Abstract

In semiconductor industries wafers are processed/handled in vacuum. While clamping wafers on various chucks (e.g. pinset, plates, waferchuck etc.) vacuum problems or contamination can occur. Due to vacuum problems the processed wafer can break and/or a tool-down-situation may happen. In this case manual wafer handling might be necessary. Contamination or scratches on the wafer surface can also cause misplacement of the wafer on plates or wafer-chunk (local unflatness) leading to miss-processing and/or yield loss. While using offline inspection (manual handling) not all wafers at all litho-operations can be measured (sampling). Inspection is done after the litho-process.

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Automatic Wafer Backside Inspection

Idea: Jens Bruch, DE-Dresden; Holger Hasse, DE-Dresden; Andreas Kiss, DE-Dresden; Heiko Hommen, DE-Dresden; Steffen Poegel, DE-Dresden

In semiconductor industries wafers are processed/handled in vacuum. While clamping wafers on various chucks (e.g. pinset, plates, waferchuck etc.) vacuum problems or contamination can occur. Due to vacuum problems the processed wafer can break and/or a tool-down-situation may happen. In this case manual wafer handling might be necessary. Contamination or scratches on the wafer surface can also cause misplacement of the wafer on plates or wafer-chunk (local unflatness) leading to miss- processing and/or yield loss. While using offline inspection (manual handling) not all wafers at all litho- operations can be measured (sampling). Inspection is done after the litho-process.

It is proposed to include a CCD-(Charged Coupled Devices) based backside-inspection that is implemented into the wafer-track. Right after loading the wafer into the tool the wafer moves across the CCD-camera and defect/contaminated wafers will be detected and separated. The CCD-module is detecting scratches, particles and other residues on the wafer backside. In this manner no offline inspection is necessary, the wafer is inspected while being processed.

© SIEMENS AG 2004 file: ifx_2004J52259.doc page: 1