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Structural Adhesives Containing Submicron Silicone Particles

IP.com Disclosure Number: IPCOM000029960D
Publication Date: 2004-Jul-20
Document File: 1 page(s) / 9K

Publishing Venue

The IP.com Prior Art Database

Abstract

Structural Adhesives Containing Submicron Silicone Particles. Now, novel modifiers are available. They are based on silicone-elastomer particles and silicone-elastomer/organic polymer hybrid (core-shell) particles, with diameters from about 100 to 1,000 nanometers. The hybrid particles consist of a crosslinked silicone rubber core that is surface-modified or grafted with a thermoplastic polyalkyl(meth)acrylic shell, which can optionally be functionalized to improve particle-matrix interaction.

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Structural Adhesives Containing Submicron Silicone Particles

Apart from electrical applications, many thermosetting resins. including epoxy resins, acrylates, polyurethanes and their combinations, are also used as structural adhesives, e.g. in automotive applications. These adhesives show good performance for bonding metals, plastics and composites such as SMC, GMT, GRP and CRP.

These thermosetting adhesives are usually too brittle to withstand extreme conditions, and have to be modified with special rubber components, which are dispersed in the adhesive. Organic rubbers, such as CTBN or preformed organic rubber particles, are often used to improve fracture or impact toughness. Such modifiers have the disadvantages of limited heat stability, inferior low-temperature toughness, poor dispersibility and a negative impact on the glass transition temperature of the matrix resin.

Now, novel modifiers are available. They are based on silicone-elastomer particles and silicone-elastomer/organic polymer hybrid (core-shell) particles, with diameters from about 100 to 1,000 nanometers. The hybrid particles consist of a crosslinked silicone rubber core that is surface-modified or grafted with a thermoplastic polyalkyl(meth)acrylic shell, which can optionally be functionalized to improve particle-matrix interaction.

These modifier particles can be easily dispersed in thermosetting resin systems at a primary particle level by known dispersion methods, and significantly improve...