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Interleaved Fin Heat Sink for DIMMs

IP.com Disclosure Number: IPCOM000030643D
Original Publication Date: 2004-Aug-20
Included in the Prior Art Database: 2004-Aug-20
Document File: 1 page(s) / 25K

Publishing Venue

IBM

Abstract

Computer memory subsystems are increasing in density and speed while computer enclosure sizes keep getting smaller for the same number of components; everything contributing to an increasing thermal challenge. Previously, a system with multiple DIMMS needed no direct cooling but, recently, designs have been challenged in the ability to sufficiently cool the memory subsystem. Current solutions to this problem include increasing the air flow with more fans or more expensive fans or limiting the number of DIMMS in the system. Modern chipsets help distribute this heat load among the populated DIMMS such that they all run cooler. However, a problem occurs when not all of the DIMMS are populated. In fact, the thermal problem at the memory level gets worse with fewer DIMMS, not better even though at the system level there is less total heat.

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Interleaved Fin Heat Sink for DIMMs

    This is a heat sink design which allows two heat sinks to fit in a narrow space between DIMMs

    Heat sinks are designed and placed in such a way that the fins slide past one another as the DIMM is inserted. The sinks are epoxied to the DIMMs. There are two part numbers, with HS A on the right side of every DIMM, and HS B on the left.

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