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Flow Director to Achieve Dual Purpose Cooling with Lateral Flow Heatsink with Side Mounted Fan

IP.com Disclosure Number: IPCOM000030646D
Original Publication Date: 2004-Aug-20
Included in the Prior Art Database: 2004-Aug-20
Document File: 3 page(s) / 68K

Publishing Venue

IBM

Abstract

Current cooling solutions for computer processing units and voltage regulation components are independent of one another. Voltage regulation cooling can be extremely difficult under low airflow conditions experienced in many of our systems. Currect solutions are the addition of extra regulation phases to alleviate high power densities per package, or the use of individual heatsinks epoxied to plastic packages of the VR components, making an inefficient, high cost system thermal solution. Invention is a CPU thermal solution that is comprised of an airflow director that forces high velocity airflow over the voltage regulation components, reducing the component temperature by 15-20%, bringing them below their allowable temperature in worst case scenarios. The invention solves the issue of out-of-spec voltage regulation temperatures without adding cost to the system. The cost of the flow director is a non-adder to the unit price of the heatsink. It also helps cool other board components (i.e. capacitors, inductors, and small resistors) that would have experienced higher temperatures, therefore reducing failure rates of such components.

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Flow Director to Achieve Dual Purpose Cooling with Lateral Flow Heatsink with Side Mounted Fan

    Invention consists of a fan attached to the side of a heatsink for CPU cooling with a flow director on the front side of the heatsink to support board cooling. Heat is absorbed through the base of the heatsink where the aluminum is in contact with the CPU (disgarding the thermal interface material that is between the mating surfaces for simplicity). Only a thin wall of aluminum (part of the heatsink base) separates the CPU from the two heatpipes used to transport heat from the lower aluminum plate to the upper aluminum plate. Heat that is not pumped to the upper aluminum plate via the heatpipes is conducted and spread through the lower aluminum plate to the fins upward which are in the path of high velocity airflow. The heat that is pumped to the upper aluminum plate via the heatpipes is conducted downward by the fins. The fan forces air through the length of the heatsink, exhausting the airflow out the front (shown in Figure 1 below). Approximately one-half of the airflow is then directed toward the voltage regulation components, on the motherboard, by means of this invention; the airflow director. The thermal solution satisfies the cooling of both the CPU and the voltage regulation, reducing the cost of system thermal components by alleviate the requirement for voltage regulation component heatsinks.

Figure 1. Front Isometric of the Dual Purpose Cooling Fansink

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