Browse Prior Art Database

Lateral Flow Heatsink with Side Mounted Fan and Dual Phase Technology

IP.com Disclosure Number: IPCOM000030647D
Original Publication Date: 2004-Aug-20
Included in the Prior Art Database: 2004-Aug-20
Document File: 3 page(s) / 67K

Publishing Venue

IBM

Abstract

As thermal and acoustic targets become increasingly more difficult to meet, optimization of a cooling solution is critical. The invention listed is a CPU thermal solution that is comprised of a fan and a heatsink assembled as one entity. The heatsink is comprised of aluminum slugs, aluminum fins and two heatpipes (water filled, hollow copper tubes). The advantages that this heatsink are: 1) Short flow length to reduce laminar boundary layer buildup - result is higher airflow through heatsink. 2) Ducted airflow through entire length of fins. 3) Upper and lower thick aluminum plate design to effectively absorb and dissipate heat. 4) 2 Heatpipes - one vertical and one is 13° from vertical to more effectively spread heat load to the upper base. 5) Dual phase heatpipes allow for efficient thermal solution even at lower power situations. 6) Flow directors to direct the flow which is diclosed separately due to it's independent worth (see disclosure "Flow Director to Achieve Dual Purpose Cooling with Lateral Flow Heatsink with Side Mounted Fan" for more information). 7) 2-3mm Gap between fan and heatsink to reduce acoustic effects.

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Lateral Flow Heatsink with Side Mounted Fan and Dual Phase Technology

    Invention consists of a fan attached to the side of a heatsink for CPU cooling. Heat is absorbed through the base of the heatsink where the aluminum is in contact with the CPU (disgarding the thermal interface material that is between the mating surfaces for simplicity). Only a thin wall of aluminum (part of the heatsink base) separates the CPU from the two heatpipes used to transport heat from the lower aluminum plate to the upper aluminum plate. Heat that is not pumped to the upper aluminum plate via the heatpipes is conducted and spread through the lower aluminum plate to the fins upward towards the area of high velocity airflow. The heat that is pumped to the upper aluminum plate via the heatpipes is conducted downward by the fins towards the area of high airflow. The fan forces air through the length of the heatsink, exhausting the airflow out the front (shown in Figure 1 below). Approximately one-half of the airflow is then directed toward the voltage regulation components, on the motherboard, by means of the flow director (Item 8 in Figure 3; see disclosure "Flow Director to Achieve Dual Purpose Cooling with Lateral Flow Heatsink with Side Mounted Fan" for more information). The thermal solution satisfies the cooling of both the CPU and the voltage regulation, reducing the cost of system thermal components by alleviate the requirement for voltage regulation component heatsinks.

Figure 1....