Browse Prior Art Database

Staggered stacked die optical communications.

IP.com Disclosure Number: IPCOM000030968D
Original Publication Date: 2004-Sep-02
Included in the Prior Art Database: 2004-Sep-02
Document File: 2 page(s) / 211K

Publishing Venue

Motorola

Related People

Tomasz Klosowiak: AUTHOR

Abstract

Stacked die is becoming more and more desirable and popular in system packaging – System in a package because of space savings and short signal propagation distances. The idea disclosed here proposes a new alternative way of inter-chip, very fast and compact data communication in a stack of chips. The innovation here is a concept of staggering – off-setting chips in stacked chip configuration to enable optical communication between groups of chips in the stack.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 77% of the total text.

Staggered stacked die optical communications.

Tomasz Klosowiak

Abstract:

Stacked die is becoming more and more desirable and popular in system packaging – System in a package because of space savings and short signal propagation distances. The idea disclosed here proposes a new alternative way of inter-chip, very fast and compact data communication in a stack of chips. The innovation here is a concept of staggering – off-setting chips in stacked chip configuration to enable optical communication between groups of chips in the stack.

Proposed configuration:

Die

 

Flip chip interconnect

 

Figure 1. Two various configurations of staggered stacked chip optical communication.

Depicted in Figure 1 die configuration – stacked off-set chips (staggered chips) - enables optical communication between groups of chips in the stack of chips (dies). Important components of the system are: stacked functional chips equipped with optical send / receive capability – i.e. active optical devices (such as laser and photodiode). Chips are in pairs. Galvanic connection wherever needed might be realized by for example flip chip method.  Back to back chip connection may be realized by for example adhesive or solder.  As depicted the above concept enables optical communication between adjacent groups of chips and also between every other group of chips.  Optical connection enables very fast data communication between chips.  The configuration is very compact (very efficient space utilization)...