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Method of interconnecting a vertical transistor chip in direct chip attachment (DCA) technology using a copper clip

IP.com Disclosure Number: IPCOM000031165D
Original Publication Date: 2004-Sep-15
Included in the Prior Art Database: 2004-Sep-15
Document File: 4 page(s) / 24K

Publishing Venue

Motorola

Related People

Robert Bauer: AUTHOR [+3]

Abstract

Abstract Vertical transistor chips provide source, drain, gate and sense signal contacts on opposite chip sides. Direct chip attachment (DCA) of such a transistor chip on a carrier requires appropriate methods in order to establish electrical and/or thermal connection to chip front side and chip backside. Existing standard technologies such as flip chip or other DCA methodologies can be used for the chip front side connection. This document describes a new, reliable and cost competitive way of establishing a chip backside connection, meeting harsh automotive qualification requirements. The method introduced by this document is based on the application of a copper clip with a special design, which is soldered or glued to the chip backside and carrier surface.

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Method of interconnecting a vertical transistor chip in direct chip attachment (DCA) technology using a copper clip

Robert Bauer, Torsten Hauck, Anton Kolbeck

© 2004 Freescale Semiconductor, Inc.

Page 2 of 4

Abstract

Vertical transistor chips provide source, drain, gate and sense signal contacts on opposite chip sides. Direct chip attachment (DCA) of such a transistor chip on a carrier requires appropriate methods in order to establish electrical and/or thermal connection to chip front side and chip backside. Existing standard technologies such as flip chip or other DCA methodologies can be used for the chip front side connection.

This document describes a new, reliable and cost competitive way of establishing a chip backside connection, meeting harsh automotive qualification requirements.

The method introduced by this document is based on the application of a copper clip with a special design, which is soldered or glued to the chip backside and carrier surface.

                       Body The backside connection of a DCA device is formed by gluing or soldering a copper clip with a special shape to the chip backside and a carrier surface (see figure 1, showing an example for use of the clip in a flip chip application). The clip shape is designed such, that a compliant interconnect to the chip backside is achieved. Key design features are the V-shape of the clip combined with the double comb structure of the device (see figure 2). The clip core material is copper, and may be plated with alloy that is compatible to applied glue or solder material.

The compliance of the clip is achieved by the special shape in combination with the copper base material and reduces the mechanical st...