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Idea submitted to CMP wafer manufacturing

IP.com Disclosure Number: IPCOM000031475D
Publication Date: 2004-Sep-27
Document File: 1 page(s) / 9K

Publishing Venue

The IP.com Prior Art Database

Abstract

"Wafer Scrap Prevention"

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

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THIS COPY WAS MADE FROM AN INTERNAL HITACHI DOCUMENT AND NOT FROM THE PUBLISHED BOOK

HSJ820040175 Bob Martin/US/HGST@HGST Gary Soares

Idea submitted to CMP wafer manufacturing

  A padded fixture has been added to an area where wafers were dropping, caused by tool mishandling. Where before, wafers were dropping and breaking, are now being caught and saved.

Disclosed by Hitachi Corporation

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