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SELF-PINNED SENSOR WITH CoPt LAYER IN AP1

IP.com Disclosure Number: IPCOM000031481D
Publication Date: 2004-Sep-27
Document File: 1 page(s) / 9K

Publishing Venue

The IP.com Prior Art Database

Abstract

The pinning of the self-pinned sensor is improved by incorporating Co-Pt high Hc material in one embodiment and Ni45Fe55 high positive magnetostriction material in the second embodiment.

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This is the abbreviated version, containing approximately 100% of the total text.

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THIS COPY WAS MADE FROM AN INTERNAL HITACHI DOCUMENT AND NOT FROM THE PUBLISHED BOOK

HSJ820030022 Lew Nunnelley/US/HGST Harry Gill

SELF-PINNED SENSOR WITH CoPt LAYER IN AP1

The structures for these two embodiments are:

Embodiment 1: NiFeCr/NiFe/PtMn/CoPt/Ru/CoFe/Cu/CoFe/NiFe/Ta PtMn under CoPt is very thin (< 30 A) and is part of the seed layer structure. Embodiment 2: This is for the CPP sensor Ta/NiFeCr/NiFe/PtMn/Ni45Fe55/CoFe/Ru/CoFe/Cu/CoFe/NiFe/Ta

Disclosed by Hitachi Corporation

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