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Combined microprocessor lock and heat sink retention device for ZIF socket microprocessors.

IP.com Disclosure Number: IPCOM000031510D
Original Publication Date: 2004-Sep-28
Included in the Prior Art Database: 2004-Sep-28
Document File: 3 page(s) / 32K

Publishing Venue

IBM

Abstract

Present-day ZIF sockets for x86 microprocessors have a major drawback in that they require separate actions to remove the heat sink from the retention module then remove the microprocessor from the socket. This disclosure describes an invention that allows the heat sik and micrprocessor to be retained using a common lever/retention mechanism.

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Combined microprocessor lock and heat sink retention device for ZIF socket microprocessors.

This disclosure describes an invention to ease the insertion and removal of x86 microprocessors in servers, workstations, and personal computers. Present methods of ZIF-socket (zero insertion force) microprocessor installation have one very poor characteristic. The microprocessor must be locked into the socket before the heat sink can be fastened on top of the microprocessor. This prevents the computer or server manufacturer from providing a replacement or upgrade microprocessor with an integrated heat sink. This also reduces the reliability of the processor by breaking the seal of the thermal interface material between the processor and the heat sink. This also causes much fewer customers to feel comfortable upgrading or replacing their own processors, causing more help desk phone calls and more on-site service calls. Finally, this increases the overall system assembly time. Ultimately, this leads to higher costs to the manufacturer.

The invention solves this problem by integrating the microprocessor locking mechanism into the heat sink retention latch. The invention uses the existing sliding mechanism in the typical ZIF socket along with a latch that simultaneously locks the processor into the socket and locks the heat sink onto the processor with the required retention force. This, then, would allow the processor and heat sink to come as packaged pair, providing for muc...