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Breakage free plastic cover by hybrid molding

IP.com Disclosure Number: IPCOM000031867D
Original Publication Date: 2004-Oct-15
Included in the Prior Art Database: 2004-Oct-15
Document File: 3 page(s) / 71K

Publishing Venue

IBM

Abstract

A plastic enclosure design method for Notebook PC which is molded by hybrid process and breakage free structure

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Breakage free plastic cover by hybrid molding

Disclosed is a plastic enclosure design method for Notebook PC which is molded by hybrid process and breakage free structure.

There are many causes which result the breakage of plastic cover of notebook PC.
1. Repeated stress on the cover
2. The stress which caused by the stress on the cover between 2 (or 3) screws fixed.
3. The stress concentration caused by the result of many accumulated tolerances .

Fig.1 shows a general enclosure design of Notebook type computer. Normally the covers like both Keyboard Bezel (indication A) and Display Bezel (indication B) are plastic and molded by hard material. But at the area of causing stress concentration by the reason of described above 3, the breakage tend to cause on the cover.

In order to avoid this kind of result, the following design and hybrid molding is applied.

Fig.2 shows the sample of Display Bezel part. The main material (Blue) almost fills the structure of this part and the area "C" and "D" is designed to be flexible shape as shown. And in order to complete whole structure of display bezel, the soft material (Green) covers these areas by hybrid molding. If this part receives the stress shown by the arrows, this part withstands to these stress because of these flexbile shape.

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Fig.3 shows the sample of Keyboard Bezel part. The area "E" tends to breake by the stress shown by arrows. The figure "F" is f...