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A Micro-Channel or Pin Grid Cooler Fabricated from Copper

IP.com Disclosure Number: IPCOM000032213D
Publication Date: 2004-Oct-26
Document File: 3 page(s) / 75K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a copper micro-channel or pin grid cooler, which is created by electroforming a copper structure onto a copper disk. Benefits include a solution that is compatible with high-volume manufacturing.

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A Micro-Channel or Pin Grid Cooler Fabricated from Copper

Disclosed is a method for a copper micro-channel or pin grid cooler, which is created by electroforming a copper structure onto a copper disk. Benefits include a solution that is compatible with high-volume manufacturing.

Background

Currently, it is difficult to effectively cool the microprocessor die. The current state of the art uses a passive cooling method, where the back of the die is attached to a copper heat spreader using a thermal interface material (see Figure 1). The heat spreader then dissipates heat to the environment by convection.

General Description

Cooling with an array of micro-channels or micro-pin fin bundles removes significantly more heat from an IC chip than passive cooling systems.  These micro-channel or pin grid array structures are either fabricated in, or are in contact with, the back side of the die. Consequently, these structures are typically fabricated in silicon. 

The disclosed method, however, uses micro-channels or pin grid structures that are made from copper; these structures remove more heat and are substantially less expensive than equivalent structures produced in silicon. Figure 2 shows the copper cooler attached to the silicon wafer.

The process for creating the micro-channels is as follows:

1.      A plastic template is formed that is the mask for an electrodeposition of copper. 

2.      A “gate plate” is formed at the top of the mold, and is made of OFHC copper. This gate plate...