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An Integrated Spring-Loaded Socket Cover for Reducing Mechanical Load on the BGA Socket Interconnect Systems

IP.com Disclosure Number: IPCOM000032219D
Publication Date: 2004-Oct-26
Document File: 2 page(s) / 49K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses an integrated spring-loaded BGA socket cover to reduce load on the package-to-board interconnect, and provide increased mechanical loads.

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An Integrated Spring-Loaded Socket Cover for Reducing Mechanical Load on the BGA Socket Interconnect Systems

Disclosed is a method that uses an integrated spring-loaded BGA socket cover to reduce load on the package-to-board interconnect, and provide increased mechanical loads.

Background

Mechanical loads and the temperature generated by a CPU and surrounding mother board components can cause interruptions in electrical functionality. These interruptions are caused by shorts in the eutectic socket BGA joints. The current solution to this problem is limiting the mechanical load applied by the heat sink (see Figure 1).

General Description

In the disclosed method, the integrated socket cover can move vertically, and it incorporates four springs between the socket body and the cover to maintain a small fixed gap (~0.025”) while in its unassembled state. The cover has three sides that surround the socket body, and stand 0.025” away from the bottom plane of the solder spheres. This feature prevents interference with the SMT assembly. Once the socket is mounted to the mother board, the cover compresses with a small amount of force and makes contact with the socket body during package assembly.  The three sides may also make contact with the board when the cover is compressed.

As the interconnect system (i.e. solder joints and the socket contact mechanism) begins to creep under mechanical load and temperature, the load is transferred through the socket cover, thereby reducing l...