Browse Prior Art Database

Multi-Core Wire

IP.com Disclosure Number: IPCOM000032222D
Publication Date: 2004-Oct-26
Document File: 2 page(s) / 113K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a new multi-core wire with an inner layer of Nickel and Copper, and an outer layer of Gold. Benefits include improving wire bond strength.

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Multi-Core Wire

Disclosed is a method for a new multi-core wire with an inner layer of Nickel and Copper, and an outer layer of Gold. Benefits include improving wire bond strength.

Background

A soft wire is used in the current wire bonding process. Using a soft wire can lead to a wire being swept away, bent, or broken during the bonding process. As future wire bonding processes move toward using a thinner wire, these problems will become more severe. During compression bonding process, soft wire will cause less pressure and less metallurgical bonding formed at the center of the wire bump formed. This will lead to electrical open connection.

 

General Description

The disclosed method uses a wire with an inner core of Nickel and Copper, and an outer layer of Gold for the wire bonding process (see Figure 1). The inner core is composed of 50% Nickel and 50% Copper. The new multi-core wire produces a wire ball with a flatter surface, compared with pure Gold wires. A flat wire ball improves bonding by reducing the impact force at the bond pad (see Figures 2 and 3). Aside from the addition of the multi-core wire, the disclosed method does not alter the wire bonding process.

Advantages

The disclosed method reduces wire sweep and breakage, eliminates wire bending, and improves overall bond strength.

Fig. 1

Fig. 2

Fig. 3

Disclosed anonymously