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New Printed Electronics / IC RFID Tag Assembly, Attachment and Label Conversion Process, Devices and Products

IP.com Disclosure Number: IPCOM000033041D
Publication Date: 2004-Nov-22

Publishing Venue

The IP.com Prior Art Database

Abstract

This innovation is a continuous or indexing synchronized process to produce assembled printed electronic devices such as a complete RFID inlay / label. An example use of this process invention is an RFID Inlay Process with automated quality testing is synchronized with Label Conversion process with automated quality testing in order to produce a completely and converted RFID label. This process includes using utilizing single and heads attachment devices for attaching micro-chip(s) and/or printed electronics to a variety of substrate(s). These substrates may include conductive inks for use with a variety of different substrates as well as other new device(s) and products for continuous RFID Quality Control testing and label conversion

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Updated November 20, 2004

CONFIDENTIAL AND PROPIETARY

New Printed Electronics / Microchip Attachment and Label Conversion Process, Devices and Products

Abstract

This innovation is a continuous or indexing synchronized process to produce assembled printed electronic devices such as a complete RFID inlay / label. An example use of this process invention is an  RFID Inlay Process with automated quality testing is synchronized with Label Conversion process with automated quality testing in order to produce a completely and converted RFID label. This process includes using utilizing single and heads attachment devices for attaching micro-chip(s) and/or printed electronics to a variety of substrate(s).  These substrates may include conductive inks for use with a variety of different substrates as well as other new device(s) and products for continuous RFID Quality Control testing and label conversion

Background – Field of Invention

The new process is a continuous flow process to attach micro chips to substrates which can contain conductive ink, for such use as production of printed electronics. This process can also be use to produce tags (transponders) and labels for Radio Frequency Identification applications by capacity balancing, synchronous processing, and automatic quality control testing. The process can assembly standard components (microchips and substrates) with specialized new devices that contain several new and / or improved component product designs, including modular attachment and automatic testing / quality control.  This process also has in line conversion equipment.  For example this equipment can convert the RFID tags into a multiple label formats, including merging the tags into pressure sensitive labels.  The process is an integrated “end to end” process. This process is achieved through capacity balancing, synchronous assembly processing and automatic testing / quality control.  This process innovation solves many current problems with the RFID technology including low yields of performing inlay / labels, poor quality control, and logistics issues.

Confidential              Page 1          11/22/2004

Description -Overall Process

Note: all reference numbers are related to Figure 3 unless noted.

 Reference Figure 1 – Overall Process Diagram and Figure 2 Overall Process Equipment Layout. There are two main parts of the process. Part 1 is the production of an RFID tag (inlay), and part 2 is the conversion of the tag (inlay) into a label.  Part 2 is optional as the end user’s may require only a tag and not an integrated RFID tag/ label. A preferred embodiment of the present invention including both process parts 1 and 2 are illustrated in Fig 1 and 2. The overall process uses several innovative devices, including modular chip attachment and tag to label conversion and multiple quality control points.

The process utilizes synchronous dimensions between the chip attach and substrate locations. The process utilizes speed ch...