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LCD Module SR film ramination on ACF for Bump stress

IP.com Disclosure Number: IPCOM000033077D
Original Publication Date: 2004-Nov-24
Included in the Prior Art Database: 2004-Nov-24
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Abstract

Disclosed is a LCD module assembly device which withstands against shock kind of stress. The critical part is reinforced by design assembly technic then the LCD module withstands very hight stress.

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LCD Module SR film ramination on ACF for Bump stress LCD Module SR film ramination on ACF for Bump stressLCD Module SR film ramination on ACF for Bump stress LCD Module SR film ramination on ACF for Bump stress

Fig. 1 shows the structure of LCD module device. Almost all LCD module has the same or the similar structure like this. The glass with PCB assembly is held by the mold frame. The glass plate is on the opposite side of mold frame and the PCB assembly is in the back side. The COF film connects between the glass and PCB assembly. The light guide panel is attached on the back side of the mold frame. The metal frame covers and holds from the opposite side of the glass to the light guide panel.

Among these structure of parts the glass with PCB assembly has the most heavy weight . When LCD module receives unexpected shock kind of stress, if the glass part moves in the mold frame, the big stress causes on the COF film. In some case this COF film and its signal line has cuts then the defect occures .

Fig. 2 shows this defect phenomenon. At the end of the adhesive ACF the COF is cut. Fig. 3 shows the design consideration to this problem. In the area shown as "A" the solder resist is applied to the ACF area and both of them are laminated and connected. this results the reinforcement of COF connection between the glass and PCB.

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