Browse Prior Art Database

25x UPH Improve on Underfill Process for FCIP

IP.com Disclosure Number: IPCOM000033082D
Original Publication Date: 2004-Dec-25
Included in the Prior Art Database: 2004-Dec-25
Document File: 1 page(s) / 253K

Publishing Venue

Siemens

Related People

Juergen Carstens: CONTACT

Abstract

The core of the idea is to produce the Flip Chip In Package (FCIP) with through hole Printed Circuit Board (PCB) substrate using an existing underfill system but approximately 25 times the UPH (Units per Hour) (see Figure 2). For that, the UPH is improved by almost 25X using proven showerhead concept but with more control parameters. Each hole has a thin wall, which is located at the center of each package in pancake format. The underfill is dispensed from the backside of the substrate with the center hole at each package unit. In addition, there is an underfill flow on the die passivation rather than on the substrate's surface. So, there is no chance for the underfill to drip on the die backside. Snap UV (ultraviolet light) / IR (infrared light) cure is used to secure the filled shape before flip over the substrate.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

S

25x UPH Improve on Underfill Process for FCIP

Idea: Alex Lin Tiang Hock, SG-Singapore

The core of the idea is to produce the Flip Chip In Package (FCIP) with through hole Printed Circuit Board (PCB) substrate using an existing underfill system but approximately 25 times the UPH (Units per Hour) (see Figure 2). For that, the UPH is improved by almost 25X using proven showerhead concept but with more control parameters. Each hole has a thin wall, which is located at the center of each package in pancake format. The underfill is dispensed from the backside of the substrate with the center hole at each package unit. In addition, there is an underfill flow on the die passivation rather than on the substrate's surface. So, there is no chance for the underfill to drip on the die backside. Snap UV (ultraviolet light) / IR (infrared light) cure is used to secure the filled shape before flip over the substrate.

This new method reduces capital investment costs for the equipment. Only the dispensing unit on the existing underfill system has to be modified.

Fig. 1: Current Method

Fig. 2: Proposed Method

© SIEMENS AG 2004 file: ifx_2004J53426.doc page: 1

[This page contains 2 pictures or other non-text objects]