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Method for polyimide-aerogel sandwich films as dielectric materials for electronic packaging

IP.com Disclosure Number: IPCOM000033132D
Publication Date: 2004-Nov-29
Document File: 3 page(s) / 54K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for polyimide-aerogel sandwich films as dielectric materials for electronic packaging. Benefits include improved functionality and improved performance.

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Method for polyimide-aerogel sandwich films as dielectric materials for electronic packaging

Disclosed is a method for polyimide-aerogel sandwich films as dielectric materials for electronic packaging. Benefits include improved functionality and improved performance.

Background

      A requirement exists for each new microprocessor generation to have electronic packaging with dielectric insulating materials that have low dielectric constants. The dielectric materials must be strong enough to withstand low-coefficient for thermal expansion (CTE) or high-stress environment applications.

      Conventionally, most dielectric build-up materials in electronic packaging are silica-filled epoxies. Some research into aerogel-based dielectrics is known but that research is not focused on creating a strong low dielectric-constant material (see Figure 1).

      Conventionally, the problem is solved by silicon- filled epoxy-based polymers that are generated in monolayers with the required properties. These materials are laser drilled and metallized to form microvias and copper trace patterns.

      Some existing packaging (primarily flexible) uses polyimide films as a dielectric material. However, they are typically monolayered films and none of them use an aerogel.

General description

      The disclosed method is the use of an aerogel-polyimide sandwich material as dielectric insulating layers in electronic packaging.

      A polyimide/aerogel thin-film sandwich is a dielectric material that is strong, easily processable, and has a very low dielectric constant (between 1.1 and 2.5). This dielectric material sandwich is useful in high-speed microelectronic packaging.

Advantages

              The disclosed method provides advantages, including:

•             Improved functionality due to providing an aerogel/polyimide composite dielectric material

•             Improved performance due to providing a very low dielectric constant, which decreases signal-line capacitance, cross-coupling noise, impedance, and signal degradation

Detailed description

      The disclosed method includes...