Browse Prior Art Database

Method for socket-side capacitors

IP.com Disclosure Number: IPCOM000033142D
Publication Date: 2004-Nov-29
Document File: 2 page(s) / 19K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for socket-side capacitors. Benefits include improved functionality and increased capacitance available for power delivery decoupling needs.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 93% of the total text.

Method for socket-side capacitors

Disclosed is a method for socket-side capacitors. Benefits include improved functionality and increased capacitance available for power delivery decoupling needs.

Background

      Power delivery requirements for CPU packages increase with every generation. Real estate on the package is limited, and solutions tend to increase the substrate size.

      Conventionally, the problem is solved by increasing substrate size for the package and adding additional capacitors to the package and/or the motherboard.

Description

      The disclosed method is a socket with capacitors mounted on the top side of the connector, around the socket perimeter. Socket internal power and ground layers are required for connectivity between the passive components and the die (see Figures 1 and 2).

      The disclosed method can be implemented using the following steps:

1.   Manufacture the socket with land pads on the top surface.

2.   Apply solder paste.

3.   Mount the capacitors.

4.           Reflow the capacitors.

5.   Visually inspect device.

6.   Test the device.

Advantages

              The disclosed method provides advantages, including:

•             Improved functionality due to using the idle surface area of the socket

•             Improved functionality due to relocating motherboard decoupling capacitors closer to the die

•             Improved functionality of the socket by integrating passive components

•             Avoid additional pa...