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Method for an on-package inductor using chained wirebonds

IP.com Disclosure Number: IPCOM000033860D
Publication Date: 2004-Dec-30
Document File: 4 page(s) / 95K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an on-package inductor using chained wirebonds. Benefits include improved functionality, improved performance, and improved ease of implementation.

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Method for an on-package inductor using chained wirebonds

Disclosed is a method for an on-package inductor using chained wirebonds. Benefits include improved functionality, improved performance, and improved ease of implementation.

Background

      The conventional use of an on-package inductor with large inductance consumes a large package area. Large parasitic capacitance results in a lower self-resonant frequency.

      Conventionally, an on-package spiral inductor is used for wireless packages. To achieve a large inductance, a large package area is required. When the package area for the inductor increases, the parasitic capacitance increases. Additionally, the trace width should be large to get a good Q-factor (see Figure 1).

      Conventionally, the problem is solved by using a planar spiral inductor for on-package integrated inductors and using a large package area for large inductance.

General description

      The disclosed method uses chained wirebonds to crate an on-package inductor within a small package area but with a large inductance. Additionally, the Q-factor is large enough for applications. Inductance, Q-factor, and self-resonant frequency can be controlled almost independently.

Advantages

              The disclosed method provides advantages, including:

•             Improved functionality due to providing an on-package inductor with large inductance in a small area

•             Improved functionality due to controlling the inductance by wire-bond length and numbers

•             Improved functionality due to controlling the Q-factor with the wire-bond diameter

•             Improved functionality due to controlling the parasitic capacitance with the space between wirebonds

•             Improved functionality due to controlling the self-resonant frequency wit...