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Embedded PCB Module for High-Density, High-Speed Transmission

IP.com Disclosure Number: IPCOM000033870D
Publication Date: 2004-Dec-30
Document File: 2 page(s) / 15K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that embeds higher performance materials and/or substrates into a conventional multilayer PCB. Benefits include being able to alter locally the electrical and mechanical properties of a PCB.

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Embedded PCB Module for High-Density, High-Speed Transmission

Disclosed is a method that embeds higher performance materials and/or substrates into a conventional multilayer PCB. Benefits include being able to alter locally the electrical and mechanical properties of a PCB.

Background

Currently, it is not possible to selectively (and locally) change the materials and circuit density within an individual PCB layer. The current state of the art encounters spatial disk issues in selective regions.

General Description

The disclosed method uses a prefabricated module laminated into a PCB (see Figure 1). The module can be a simple unique material, a two-layer high-density substrate, or a multiple high-density substrate.

The module is embedded into a cavity of the PCB, and laminated with an adhesive and copper layer. The module is then accessed either by standard through-hole vias or u-via connections.  The u-via connections are most favorable, because the laser process can actively register the top layer to the module.

Advantages

The disclosed method can alter locally the electrical and mechanical properties of a PCB. In addition, it places high-density regions onto a PCB without requiring that the whole panel go through the high-density fabrication process.

Pre-Routed Core

Std Adhesive / Prepreg

Std Core

 

High Density and/or Alternate Material module

 

Copper Foil

Std Adhesive

 

Fig. 1

Disclosed anonymously