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Wire Form Spring Clip for Heat Sink Attached to a Motherboard by Wave Soldering

IP.com Disclosure Number: IPCOM000034011D
Publication Date: 2005-Jan-11
Document File: 3 page(s) / 54K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that attaches wire form clip for a IC heat sink by wave soldering the wire clip ends to the motherboard. Benefits include a solution that is more cost effective than the current state of the art.

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Wire Form Spring Clip for Heat Sink Attached to a Motherboard by Wave Soldering

Disclosed is a method that attaches wire form clip for a IC heat sink by wave soldering the wire clip ends to the motherboard. Benefits include a solution that is more cost effective than the current state of the art.

Background

Current motherboard mounted heat sinks for surface mount integrated circuits use either wire spring clips that attach to through hole mounted pins (THM) that form a hook at two or four sides of the package, or the heat sink itself has pins that are wave soldered to the motherboard.  The wire spring clip with THM hooks add additional cost to the attachment assembly, but the wire spring clips provide an excellent soft loading device that can deliver adequate preload for thermal performance, centered loading, and absorb mechanical tolerances of the assembly. The wave solder approach provides single-part assembly to the motherboard thus eliminating the hook cost and can be integrated on the board/component assembly line; however, it does not provide sufficient preload on the thermal interface material or centered loading to be an efficient thermal solution as surface mount component powers increase in the future.

General Description

The disclosed method combines the above advantages by using a wire form clip that attaches by wave soldering the wire clip ends through the motherboard (see Figures 1 and 2). This wire form clip spans from one corner of the Integrated circuit (IC...