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Prototype Printed Circuit Production

IP.com Disclosure Number: IPCOM000034034D
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-26
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Murcko, RM: AUTHOR

Abstract

Traditional methods of producing printed circuit prototypes require many steps which include photomask generation, application of resist, exposing the resist, developing the resist, etching the copper and stripping the resist. The technique described herein can eliminate the first four steps. There are presently several printed circuit design aid programs specifically intended for personal computers, and these programs allow one to input the actual physical design of the printed circuit board and receive the output from either a dot matrix printer or a plotter. The output to the plotter is intended to be used as the master to produce a photomask, and the printer output is a quick check of the design.

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Prototype Printed Circuit Production

Traditional methods of producing printed circuit prototypes require many steps which include photomask generation, application of resist, exposing the resist, developing the resist, etching the copper and stripping the resist. The technique described herein can eliminate the first four steps. There are presently several printed circuit design aid programs specifically intended for personal computers, and these programs allow one to input the actual physical design of the printed circuit board and receive the output from either a dot matrix printer or a plotter. The output to the plotter is intended to be used as the master to produce a photomask, and the printer output is a quick check of the design. The present arrangement utilizes the printer output to drive an all- points addressable QUIETWRITER* printer and deposits the ink material on TEFLON** coated paper as shown in Fig. 1, where the reference character 1 indicates the paper, the TEFLON coating is indicated at 3, and the printed circuit image from the printer ink is indicated at 5. The copper and epoxy substrate, composed of two outer layers of copper 7 and an epoxy glass layer 9, is heated on a suitable hot plate 11 and the image 5 on the paper 1 is then transferred from the coated paper 1 to the upper copper layer 7 by applying pressure to the back side of the coated paper, as shown in Fig. 1. The upper copper layer 7 of the board assembly 7-9 can now be etched in fer...