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Multi-Pitch Ball Grid Array Package and Method of Fabrication

IP.com Disclosure Number: IPCOM000034126D
Publication Date: 2005-Jan-17
Document File: 2 page(s) / 60K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a different ball pitch for each distinct group of ball grid arrays (BGA) on a single substrate and finished package. Benefits include allowing more BGA's to be connected to a board without increasing the cost of the solution.

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Multi-Pitch Ball Grid Array Package and Method of Fabrication

Disclosed is a method that uses a different ball pitch for each distinct group of ball grid arrays (BGA) on a single substrate and finished package. Benefits include allowing more BGA’s to be connected to a board without increasing the cost of the solution.

Background

Currently, the packaging group is working to enable complex designs within the package that meet customer’s ball-out concerns. The key concern is to use the cheapest solution for board-level routing. To do this, BGA arrays of five deep or less are created, with a center array of ganged power and ground pins; this configuration remains within current board routing constraints. By ganging the center array into four pads for the vss, a single board via can be used for the connection. A low-cost solution is also enabled if a different pitch can be used on this island.  For example, a 0.5mm pitch window from a BGA is used, with a .65 pitch island for the core power and ground connections.

General Description

The disclosed method uses a different ball pitch for each distinct group of BGAs on a single substrate and finished package. Figure 2 shows that the outer ring is at a higher ball grid array pitch (0.8mm). The inner ball grid array “island” is at a smaller pitch (0.65mm) than that of the outer ring. Figure 3 shows the ball grid array is one ball pitch (0.5mm), but different from the bottom substrate ball grid array (because it uses a commodit...