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An Aligned Porous Template in Contact with a Die Backside for Enhanced Heat Removal

IP.com Disclosure Number: IPCOM000034127D
Publication Date: 2005-Jan-17
Document File: 2 page(s) / 23K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that incorporates a porous template on or in contact with the backside of the die in order to form an aligned template. Benefits include increasing the heat transfer capability of the die-to-spreader connection.

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An Aligned Porous Template in Contact with a Die Backside for Enhanced Heat Removal

Disclosed is a method that incorporates a porous template on or in contact with the backside of the die in order to form an aligned template. Benefits include increasing the heat transfer capability of the die-to-spreader connection.

Background

Currently for desktop and notebook products, heat is removed by attaching a heat spreader (typically copper) directly to the back of the microprocessor. The heat spreader is attached using a glue typically referred to as the thermal interface material (TIM). This system is shown in Figure 1. Both the thickness of the silicon itself and the TIM have a thermal resistance which decreases the ability of the system to remove heat generated by the microprocessor.

While several thermal options are being considered, there are no solutions yet to remove heat from localized hot spots.

General Description

The disclosed method incorporates an ordered array of pores on or in contact with the backside of the die in order to form a template. The pores are formed out of silicon, and are integrated with suitable nano-materials (such as carbon nano-tubes) to form a layer with a very low thermal resistance.  When the porous template is attached to a conventional heat spreader, the heat transfer capability of die-to-spreader is increased.  Alumina can be grown, for example, with ordered pores that are normal to the substrate using anodization methods (IEEE Transactions on Magnetics, vol. 36(1), 2000).  Pores that run perpendicular to the substra...