Browse Prior Art Database

Land Grid Array to Ball Grid Array Adapter

IP.com Disclosure Number: IPCOM000034131D
Publication Date: 2005-Jan-17
Document File: 3 page(s) / 75K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a form fitting "pocket" that receives and retains the land grid array (LGA), eliminating the need for the zero insertion force (ZIF) latching mechanism. Benefits include the ability to reuse the existing production ball grid array (BGA) test contactor.

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Land Grid Array to Ball Grid Array Adapter

Disclosed is a method that uses a form fitting “pocket” that receives and retains the land grid array (LGA), eliminating the need for the zero insertion force (ZIF) latching mechanism. Benefits include the ability to reuse the existing production ball grid array (BGA) test contactor.

Background

Currently, different IC packages require different sockets in order to be mounted onto a PCB. For example, LGA packages cannot be mounted onto BGA pads. In addition, each new package validation and testing requires a new test contactor. New contactors are fabricated for testing new packages on the production floor. Again, this prevents LGA packages from being able to  seat properly on BGA test contactors (i.e. test sockets).  Simultaneous production/tests using both package types requires two types of contactors; this requires more factory floor space, higher capital costs, and possibly constraining the volume upside capacity.

General Description

The disclosed method is a pocket that is not much bigger than the package that fits within it. The walls are thin, and only the two sidewalls are fully covered so that the pocket structure can stay sturdy.  The front and rear areas of the pocket are kept opened. The LGA package is slotted in the front and stops when it reaches the stopper at rear of the pocket. The pocket is made of a heat dissipating material. The material is stiff and easily fabricated (see Figures 1 and 2).  Figure 3 shows...