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Serpentine Substrate Plating Bar for Matrix Array Packages

IP.com Disclosure Number: IPCOM000034132D
Publication Date: 2005-Jan-17
Document File: 2 page(s) / 65K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses an improved substrate circuit design for the plating bar of the matrix array package (MAP). Benefits include a solution that enables the cost effective use of laser or water jet technologies.

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Serpentine Substrate Plating Bar for Matrix Array Packages

Disclosed is a method that uses an improved substrate circuit design for the plating bar of the matrix array package (MAP). Benefits include a solution that enables the cost effective use of laser or water jet technologies.

Background

Current singulation strategies either use a costly second pass (which decreases equipment utilization by 50%), or require higher cost substrate manufacturing processes, which add a process step to etch away the plating bar.

General Description

The disclosed method improves the substrate circuit design for the plating bar in the MAP format. It uses a “serpentine” plating bar layout for the substrate, which allows package singulation in a single pass when using advanced singulation methods, such as lasers, water-jets, or other methods that have a narrow kerf (i.e. cutting width). Laser and water jet tools are already being used in a limited way for wafer dicing and package singulation (which typically uses wafer dicing equipment).

Laser and water jet singulation removes brittle/fragile materials without mechanical damage; it also enables a higher uptime because blades are changed less frequently, and has the ability to cut around corners and start or stop at any location in the cut.

Advantages

The disclosed method enables the cost effective use of laser or water jet technologies.

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Disclosed anonymously