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Pedestal Pin Registration System for Multi-Layer Lamination

IP.com Disclosure Number: IPCOM000034183D
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-26
Document File: 2 page(s) / 63K

Publishing Venue

IBM

Related People

Doran, DE: AUTHOR [+2]

Abstract

The construction of multi-layer printed circuit laminates is typically done with laminate tooling which uses precision machined registration holes which correspond to similarly shaped registration pins mounted on a carrier fixture (Fig. 1) to control the placement of stacked internal planes with respect to the tooling. Because of the high temperature and pressure encountered during lamination and the uneven heating of the tooling in relation to the part being built, product stress and plane misalignment takes place. A round (or other configuration) pedestal pin that is not fixed to the carrier fixture serves as a registration device which does not align the internal planes with the tooling to achieve the proper registration but aligns one plane to another plane to permit the tooling and the product to move independently.

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Pedestal Pin Registration System for Multi-Layer Lamination

The construction of multi-layer printed circuit laminates is typically done with laminate tooling which uses precision machined registration holes which correspond to similarly shaped registration pins mounted on a carrier fixture (Fig.
1) to control the placement of stacked internal planes with respect to the tooling. Because of the high temperature and pressure encountered during lamination and the uneven heating of the tooling in relation to the part being built, product stress and plane misalignment takes place. A round (or other configuration) pedestal pin that is not fixed to the carrier fixture serves as a registration device which does not align the internal planes with the tooling to achieve the proper registration but aligns one plane to another plane to permit the tooling and the product to move independently. The pedestal pin works as follows. The pedestal pin 1 (Fig. 2) is placed in an opening 2 of a bottom carrier 3. The opening 2 is sufficiently larger than the pin 1 to allow the pin 1 to move. The construction of the laminate begins with the placement of press pads 4 over the pin 1. A bottom planishing plate 5 is then placed over press pads 4 and the laminate assembly 6, consisting of alternating layers of cores 7 and dielectric layers 8. A top planishing plate 9, additional press pads 10 and a top carrier 11 complete the pedestal pin registration system.

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When this assembl...