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Mixed Metal Deposition by Laser Photothermal Dissociation for Electronic and Metallurgical Applications

IP.com Disclosure Number: IPCOM000034257D
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-27
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Puligandla, V: AUTHOR [+2]

Abstract

A novel technique for mixed metal deposition by laser-induced photothermal dissociation is described. The technique reduces process steps and complexity in Surface Mount Assembly. It can also be used to provide corrosion protection of complex parts via surface coatings. Oranometallic compounds, such as metal alkyls, carbonyls, or metal-ligand structures, with relatively low bond energies, serve as precursors for laser induced dissociation. Laser irradiation of these precursor compounds in condensed or gas phase results in either photochemical or photothermal decomposition leading to the formation of metal [1, 2, 3]. The concept described uses a mixture of precursor compounds and in-situ deposition of mixed metals (alloys) on a substrate.

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Mixed Metal Deposition by Laser Photothermal Dissociation for Electronic and Metallurgical Applications

A novel technique for mixed metal deposition by laser-induced photothermal dissociation is described. The technique reduces process steps and complexity in Surface Mount Assembly. It can also be used to provide corrosion protection of complex parts via surface coatings. Oranometallic compounds, such as metal alkyls, carbonyls, or metal-ligand structures, with relatively low bond energies, serve as precursors for laser induced dissociation. Laser irradiation of these precursor compounds in condensed or gas phase results in either photochemical or photothermal decomposition leading to the formation of metal [1, 2, 3]. The concept described uses a mixture of precursor compounds and in-situ deposition of mixed metals (alloys) on a substrate. By appropriate choices of complexes of A-X and B-Y, deposition of an alloy composition AmBn will be possible. (A and B represent two different metals, X and Y the ligands, and m:n the molar ratio of the metals). In this manner, compositions of brass composition (Cu = 65%, Zn = 35%), tin-lead solder, silver solder, bronze, stainless steel, or a whole spectrum of other compositions could be deposited on a substrate. A schematic of the experimental arrangement is shown in the figure. Constituent organometallic compounds contained in chambers A and B are heated to requisite temperatures and the resulting vapors are entrained into t...