Browse Prior Art Database

Integrated Circuit Package

IP.com Disclosure Number: IPCOM000034310D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-27
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Frankeny, RF: AUTHOR

Abstract

A method is described to provide a hybrid package for high gate current integrated circuits (ICs) with a high number of I/O drivers. This enables the best features of Tape Automated Bonding (TAB) and IBM C4 bonding processes. To solve the problems of attaching high gate count ICs to a second level package, a combination of the two techniques, C4 and TAB, is employed. The first step in the process is to connect the chip to a small piece of ceramic via C4 bonding, as shown in Fig. 1. Next a TAB tape is thermo-compression bonded to the I/O pads, as shown in Fig. 2. To attach to the card, a solder reflow operation is used. Other attachment processes are possible including conductive adhesives for the ceramic and TAB, or conductive adhesive for ceramic and thermo- compression for TAB. Now pads 1 and 2, shown in Fig.

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Integrated Circuit Package

A method is described to provide a hybrid package for high gate current integrated circuits (ICs) with a high number of I/O drivers. This enables the best features of Tape Automated Bonding (TAB) and IBM C4 bonding processes. To solve the problems of attaching high gate count ICs to a second level package, a combination of the two techniques, C4 and TAB, is employed. The first step in the process is to connect the chip to a small piece of ceramic via C4 bonding, as shown in Fig. 1. Next a TAB tape is thermo-compression bonded to the I/O pads, as shown in Fig. 2. To attach to the card, a solder reflow operation is used. Other attachment processes are possible including conductive adhesives for the ceramic and TAB, or conductive adhesive for ceramic and thermo- compression for TAB. Now pads 1 and 2, shown in Fig. 2, which connect voltage and ground to the chip, can connect directly to the card voltage and ground with very short conductors. This new package can be handled as a TAB with the advantages of a continuous reel of parts. It also allows the peripheral feature of TAB to be exploited in wiring and also allows the best features of C4 for a short conductive path to the power bus.

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