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Browse Prior Art Database

Surface Mount Component Lead Hold-Down Mechanism

IP.com Disclosure Number: IPCOM000034329D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-27
Document File: 3 page(s) / 119K

Publishing Venue

IBM

Related People

Bleau, CD: AUTHOR [+5]

Abstract

A technique is described whereby a hold-down mechanism provides proper positioning of surface mounted components (SMCs) to ensure that leads, attached to SMCs, will be correctly soldered onto printed circuit boards during automatic soldering operations. (Image Omitted) The SMC hold-down mechanism is designed to be used in solder reflow processes, which supply the melt heat to component leads by using non-contact devices, such as laser, hot-air, etc., for the solder reflow operation. Although the non-contact mechanisms have advantages over heat conduction mechanisms because of the increase in operating speed, a means must be provided to ensure that SMC leads are depressed into the solder media during the heating application. Therefore, the SMC hold-down mechanism, described herein, is designed for this function.

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Surface Mount Component Lead Hold-Down Mechanism

A technique is described whereby a hold-down mechanism provides proper positioning of surface mounted components (SMCs) to ensure that leads, attached to SMCs, will be correctly soldered onto printed circuit boards during automatic soldering operations.

(Image Omitted)

The SMC hold-down mechanism is designed to be used in solder reflow processes, which supply the melt heat to component leads by using non-contact devices, such as laser, hot-air, etc., for the solder reflow operation. Although the non-contact mechanisms have advantages over heat conduction mechanisms because of the increase in operating speed, a means must be provided to ensure that SMC leads are depressed into the solder media during the heating application. Therefore, the SMC hold-down mechanism, described herein, is designed for this function. The SMC hold-down mechanism, as shown in Fig. 1, is attached to the robot end-of-arm tool 10, which provides functions as implemented in an X-axis of a Cartesian coordinate robot. Splined robot Z-axis shaft 11 permits lead hold-down tool arm 12 and laser place/solder tool 13 to rotate together, while permitting laser place/solder tool 13 to move independently in a vertical direction. The SMC is placed onto printed circuit board 14 in a previous operation, or can be manually inserted through slot 15 in plate 16. Plate 16 is rotated by means of motor drive mechanism 17, so that lead hold-down plunger 18 can be...