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Browse Prior Art Database

Scanning Laser Conductive Paste Removal Device

IP.com Disclosure Number: IPCOM000034331D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-27
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Bleau, CD: AUTHOR [+7]

Abstract

A technique is described whereby conductive paste is automatically removed from multilayer ceramic substrates, as used in printed circuit fabrication, through the use of a scanning laser conductive paste removal device. In prior art, removal of excessive conductive paste, which caused electrical short circuits of adjacent patterns in printed circuit substrates, was performed manually. The concept described herein eliminates the need to manually remove the paste by using a galvanometer-controlled device to enable a laser beam to automatically remove the short. The scanning laser conductive paste removal device, as shown in the figure, is mounted in a fixed position over the substrate containing the electrical short caused by the paste. Positioning of substrate 10 takes place automatically from predetermined coordinates.

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Scanning Laser Conductive Paste Removal Device

A technique is described whereby conductive paste is automatically removed from multilayer ceramic substrates, as used in printed circuit fabrication, through the use of a scanning laser conductive paste removal device. In prior art, removal of excessive conductive paste, which caused electrical short circuits of adjacent patterns in printed circuit substrates, was performed manually. The concept described herein eliminates the need to manually remove the paste by using a galvanometer-controlled device to enable a laser beam to automatically remove the short. The scanning laser conductive paste removal device, as shown in the figure, is mounted in a fixed position over the substrate containing the electrical short caused by the paste. Positioning of substrate 10 takes place automatically from predetermined coordinates. The predetermined coordinates, at short location 11, were previously established through the use of short sensing equipment. An X-Y stage is used to move the substrate under the laser paste removal device. Once substrate 10 is locked in place, optics fiber glass tube 12 illuminates the shorted location. This enables related camera instrumentation to be activated. Scan data is then provided to X and Y galvanometers 13, located within the device, by means of an image processing system which is used to control the X and Y stage automatically, without operator intervention. Galvanometers 13 are then energi...