Browse Prior Art Database

Robotic Scanning Laser Placement, Solder and Desolder Device

IP.com Disclosure Number: IPCOM000034364D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-27
Document File: 4 page(s) / 128K

Publishing Venue

IBM

Related People

Bleau, CD: AUTHOR [+6]

Abstract

This article describes a device which places, solders or desolders surface mount device (SMD) components automatically. Because of increasing popularity of surface mount electronics, there exists an increasing demand for an automatic and flexible means to place, solder, and desolder SMD components during the manufacturing process. The robotic scanning laser placement, soldering/desoldering device disclosed herein is designed as an end-of-arm tool which can be adapted to all commercial robots. There are two objectives for using this device. The first objective is to place a component on a printed circuit (PC) board and solder it on the board. The second one is to desolder a defective component and remove it during the rework process. (Image Omitted) The device of this disclosure is shown in side cross section shown in Fig. 1.

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Robotic Scanning Laser Placement, Solder and Desolder Device

This article describes a device which places, solders or desolders surface mount device (SMD) components automatically. Because of increasing popularity of surface mount electronics, there exists an increasing demand for an automatic and flexible means to place, solder, and desolder SMD components during the manufacturing process. The robotic scanning laser placement, soldering/desoldering device disclosed herein is designed as an end-of-arm tool which can be adapted to all commercial robots. There are two objectives for using this device. The first objective is to place a component on a printed circuit (PC) board and solder it on the board. The second one is to desolder a defective component and remove it during the rework process.

(Image Omitted)

The device of this disclosure is shown in side cross section shown in Fig. 1. To accomplish the first objective the robot will pick up a component with the vacuum pickup 1 and traverse to the component PC board site within the accuracy capabilities of the robot. All PC board component site locations will have been previously stored in the robot controller memory by means of another vision process. X mirror 5 and Y mirror 4 will be detented (electrically or mechanically) into the component viewing position, as shown in Fig. 1. The charged-coupled device (CCD) camera and the illumination fibers in the viewing portions of the coaxial fiber optic bundle 9 will be turned on. An image of the component leads and the PC board lead pads (not shown) will be received through the converging lens system 6, the X and Y mirrors and laser focusing head 3, and will be displayed on the CCD array in the camera. The lead and pad images will be processed by a vision system to determine their relative X, Y, and O offsets. The robot Z axis O and the X-Y fine positioner 11 will be cycled until component leads are aligned to the PC board pads. The component will then be lowered and held in position, ready for solder reflow to begin.

(Image Omitted)

The solder reflow process will occur as follows: The X and Y mirror detents will first be released to permit laser scanning. A laser beam from a ND:YAG laser is transmitted through the fiber-optics bundle 9 down to a laser focusing head 3. Then the beam via a fiber- optics tee 2 is...