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Embedded Chip in a Multilayer Circuit Board for System Security

IP.com Disclosure Number: IPCOM000034375D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Wittmann, EG: AUTHOR [+2]

Abstract

An alternate circuit board construction/component packaging technique is shown for enhancing the physical security of proprietary semiconductor chips. Conventional circuit board construction places integrated circuit semiconductor chips in a module on the surface of a board in full view and provides access for probing. By enhancing the physical security of a component package, the value of proprietary chips and software information may be better protected. Better physical security can be achieved by embedding sensitive silicon chips within the layers of a circuit board where they are relatively immune from inspection and probing. To fabricate this alternate package, the initial several layers are constructed in the usual manner with some of the subsequent layers of laminate cut away to accommodate one or more chips.

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Embedded Chip in a Multilayer Circuit Board for System Security

An alternate circuit board construction/component packaging technique is shown for enhancing the physical security of proprietary semiconductor chips. Conventional circuit board construction places integrated circuit semiconductor chips in a module on the surface of a board in full view and provides access for probing. By enhancing the physical security of a component package, the value of proprietary chips and software information may be better protected. Better physical security can be achieved by embedding sensitive silicon chips within the layers of a circuit board where they are relatively immune from inspection and probing. To fabricate this alternate package, the initial several layers are constructed in the usual manner with some of the subsequent layers of laminate cut away to accommodate one or more chips. After the proprietary chips are mounted in the cavities created and the I/O connections are made, the following layers of the circuit board are utilized for their normal functions as well as to cover the buried chips. To further enhance chip and I/O security, a metal layer may be placed on each side of a buried chip to inhibit X-ray inspection. The metal may also be utilized as a ground or power plane. After completion of the circuit board fabrication, the surface is populated in the usual manner.

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