Browse Prior Art Database

Activation of Surfaces by STM Probe for Electroless Plating

IP.com Disclosure Number: IPCOM000034386D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-27
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Von Gutfeld, RJ: AUTHOR

Abstract

The scanning tunneling microscope (STM) can be used for applications relating to maskless micropatterning of a variety of materials, such as photo-electrochemical etching of n-GaAs in aqueous alkaline solutions. Additional applications include the use of a STM probe to provide high local currents to produce local heating of a submerged substrate to enhance local plating and etching for both electro and electrodeless (including electroless) processes, where the local deposition/etching enhancement mechanism is a thermal one. The STM can be used to provide local activation of a surface to permit electroless plating to commence. Since electroless plating is autocatalytic, it requires a surface which permits the chemical reaction via the reducing agent contained within the solution to take place.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 53% of the total text.

Page 1 of 1

Activation of Surfaces by STM Probe for Electroless Plating

The scanning tunneling microscope (STM) can be used for applications relating to maskless micropatterning of a variety of materials, such as photo- electrochemical etching of n-GaAs in aqueous alkaline solutions. Additional applications include the use of a STM probe to provide high local currents to produce local heating of a submerged substrate to enhance local plating and etching for both electro and electrodeless (including electroless) processes, where the local deposition/etching enhancement mechanism is a thermal one. The STM can be used to provide local activation of a surface to permit electroless plating to commence. Since electroless plating is autocatalytic, it requires a surface which permits the chemical reaction via the reducing agent contained within the solution to take place. For example, electroless nickel proceeds autocatalytically on a nickel surface, but not on copper, brass or silver. However, to produce plating on these and other noncatalytic surfaces, one method of activation is to make the substrate cathodic and pass a DC current through a local region. This type of activation is ideally suited for the STM by way of tunneling in non-conducting solutions or via conduction currents in conducting electroless solutions. This form of local activation may have particularly important applications in the plating of semiconductors which are, in general, not activated, but through which D...