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Browse Prior Art Database

Depth of Cut Tape Tester

IP.com Disclosure Number: IPCOM000034403D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-27
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Shettler, DJ: AUTHOR

Abstract

This article describes an in-line tester tool and procedure for assuring the proper depth of dicing saw cut when dicing semiconductor wafers into chips. Wafers are held during the dicing process by attachment to an adhesive tape (film) frame which acts to retain diced chips until they are individually separated ("picked") from the film surface in a follow on "picking" operation. The depth of saw cut permitted in the tape frame is very critical since, if the cut is too deep, the tape frame will tear during the "picking" operation with consequent impact on wafer yield. The drawing shows the depth of cut tape tester tool. The diced tape 1 is shown attached to the tape frame 2 without a wafer, i.e., a blank tape frame. The raised rounded dowel pin 3 simulates chip picking pressure experienced by the tape frame over it.

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Depth of Cut Tape Tester

This article describes an in-line tester tool and procedure for assuring the proper depth of dicing saw cut when dicing semiconductor wafers into chips. Wafers are held during the dicing process by attachment to an adhesive tape (film) frame which acts to retain diced chips until they are individually separated ("picked") from the film surface in a follow on "picking" operation. The depth of saw cut permitted in the tape frame is very critical since, if the cut is too deep, the tape frame will tear during the "picking" operation with consequent impact on wafer yield. The drawing shows the depth of cut tape tester tool. The diced tape 1 is shown attached to the tape frame 2 without a wafer, i.e., a blank tape frame. The raised rounded dowel pin 3 simulates chip picking pressure experienced by the tape frame over it. After the dicing saw has been adjusted to the nominal cutting depth, the blank tape frame is run through the saw, followed by the disclosed test which stretches the film by passing it over the fixture. The rounded dowel pin 3 can be adjusted to apply a pressure to the tape frame somewhat in excess of that experienced in "picking". If the round pin 3 punches a hole in the tape, the saw cut is too deep and the dicer needs to be adjusted. By stretching the tape at different points, the saw planarity can also be checked.

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