Browse Prior Art Database

Interconnection Structure for Liquid Crystal Display

IP.com Disclosure Number: IPCOM000034478D
Original Publication Date: 1989-Mar-01
Included in the Prior Art Database: 2005-Jan-27
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Sakamoto, K: AUTHOR [+2]

Abstract

This article relates to a technique which provides a corrosion- resistant interconnection structure for a liquid crystal display (LCD). To achieve corrosion-resistant and high electrical conductivity interconnection, as shown in figure, the structure disclosed herein uses an Anisotropic Conducting Film (ACF) and a metal pad covered with an insulator layer, such as SiOx or SiNx. The ACF consists of an epoxy resin and nickel particles with spinules. Interconnection is achieved by applying pressure and heat. Pressure enables the nickel particle's spinule to break the insulation layer and to penetrate into the metal pad. Then, heat cures the epoxy resin to maintain the interconnection. With this structure, a metal surface is not exposed, and high electrical conductivity and corrosion-resistant interconnection is achieved.

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Interconnection Structure for Liquid Crystal Display

This article relates to a technique which provides a corrosion- resistant interconnection structure for a liquid crystal display (LCD). To achieve corrosion- resistant and high electrical conductivity interconnection, as shown in figure, the structure disclosed herein uses an Anisotropic Conducting Film (ACF) and a metal pad covered with an insulator layer, such as SiOx or SiNx. The ACF consists of an epoxy resin and nickel particles with spinules. Interconnection is achieved by applying pressure and heat. Pressure enables the nickel particle's spinule to break the insulation layer and to penetrate into the metal pad. Then, heat cures the epoxy resin to maintain the interconnection. With this structure, a metal surface is not exposed, and high electrical conductivity and corrosion- resistant interconnection is achieved.

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